Moore's Law Runs Clean
With Aerogen Systems Point-of-Use (POU) integrated contaminantion control modules, you can continuously capture and chemically degrade airborne acids and organics inside localized microenvironments.
Fabs already control particles, airflow, and microenvironment AMCs. But products still spend critical time waiting, moving, and staging between tools, where FOUPs and localized storage environments can accumulate trace molecular contaminants from process carryover, material outgassing, and prior wafer exposure.
Aerogen Systems adds a continuous active filtration layer at the wafer level, targeting contaminants before they adsorb to sensitive surfaces and contribute to corrosion, hazing, residue formation, process drift, and yield loss.

Yield Problems?
Join Our Pilot Program
Be the first to update your cleanroom with point-of-use active filtration systems.
Join our pilot program and get ahead of the contamination tolerances your next node will demand.

Yield-Enabling The Future of Chips
Our solutions will enable fabs to push further down the node development roadmap. By eliminating the queue-time contamination that conventional AMC control misses, we protect wafer surfaces between process steps, tighten yield baselines, and reduce the excursions and rework costs that compound as design rules shrink.

Yield-Enabling The Future of Chips
Our solutions will enable fabs to push further down the node development roadmap. By eliminating the queue-time contamination that conventional AMC control misses, we protect wafer surfaces between process steps, tighten yield baselines, and reduce the excursions and rework costs that compound as design rules shrink.

Every Defect Has a Cost
By integrating our continuous destruction solutions into localized high-purity storage environments, we can actively eliminate trace organics and acid gases before they reach sensitive surfaces, accumulate during queue times, and become the yield loss you can't trace back to a tool.

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